Flexible coaxial connector

ABSTRACT

A connector device may be provided. The connector device may comprise a first electrical connector and a second electrical connector. A body may be disposed between the first electrical connector and the second electrical connector. An electrical pathway may be disposed in the body between the first electrical connector and the second electrical connector.

RELATED APPLICATION

This Application is a continuation-in-part (CIP) of U.S. applicationSer. No. 15/911,382, filed Mar. 5, 2018, which is incorporated herein byreference.

TECHNICAL FIELD

The present disclosure relates generally to electronics enclosures.

BACKGROUND

A Hybrid Fiber-Coaxial (HFC) network is a broadband network thatcombines optical fiber and coaxial cable. It has been commonly employedglobally by cable television operators. In a hybrid fiber-coaxial cablenetwork, television channels are sent from a cable system's distributionfacility (e.g., a headend) to local communities through optical fibertrunk lines. At the local community, a box translates the signal from alight beam to electrical signal, and sends it over cable lines fordistribution to subscriber residences. The optical fiber trunk linesprovide adequate bandwidth to allow future expansion and newbandwidth-intensive services.

BRIEF DESCRIPTION OF THE FIGURES

The accompanying drawings, which are incorporated in and constitute apart of this disclosure, illustrate various embodiments of the presentdisclosure. In the drawings:

FIG. 1 shows a three-piece electronics enclosure;

FIG. 2 shows a three-piece electronics enclosure;

FIG. 3 shows a three-piece electronics enclosure;

FIG. 4 shows a side view of a three-piece electronics enclosure;

FIG. 5 shows a power bypass;

FIG. 6 shows a connector;

FIG. 7 shows a three-piece electronics enclosure;

FIG. 8 shows a power supply;

FIGS. 9A, 9B, and 9C show a connector device; and

FIG. 10 shows a connector device disposed in a three-piece electronicsenclosure.

DETAILED DESCRIPTION Overview

A connector device may be provided. The connector device may comprise afirst electrical connector and a second electrical connector. A body maybe disposed between the first electrical connector and the secondelectrical connector. An electrical pathway may be disposed in the bodybetween the first electrical connector and the second electricalconnector.

Both the foregoing overview and the following example embodiments areexamples and explanatory only, and should not be considered to restrictthe disclosure's scope, as described and claimed. Further, featuresand/or variations may be provided in addition to those set forth herein.For example, embodiments of the disclosure may be directed to variousfeature combinations and sub-combinations described in the exampleembodiments.

Example Embodiments

The following detailed description refers to the accompanying drawings.Wherever possible, the same reference numbers are used in the drawingsand the following description to refer to the same or similar elements.While embodiments of the disclosure may be described, modifications,adaptations, and other implementations are possible. For example,substitutions, additions, or modifications may be made to the elementsillustrated in the drawings, and the methods described herein may bemodified by substituting, reordering, or adding stages to the disclosedmethods. Accordingly, the following detailed description does not limitthe disclosure. Instead, the proper scope of the disclosure is definedby the appended claims.

In an HFC network, a node may comprise a container that may houseoptical and electrical circuitry. An optical fiber cable may beconnected to one side of the node and a plurality of coaxial cables maybe connected to the other side of the node. The optical fiber cable maybe connected to a headend in the HFC network and the plurality ofcoaxial cables may be connected to Customer Premises Equipment (CPE) ofsubscribers to the HFC. As such, the node may facilitate communicationsbetween the headend and the CPE.

Many electronic designs may be challenged with the task of heatdissipation. This may be particularly difficult with outdoor HFC cableenclosures (e.g., nodes) because they may be hermetically sealed and maynot use forced convection. Instead, natural convection through the useof finned die casted enclosures may be used. These outdoor enclosuresmay also use removable internal modules for electronics to make repairseasier as the enclosures themselves may be connected to a network withhardline coaxial cables, power, and fiber for example.

Removing the enclosure may require the hardline to be cut so theenclosure can be removed thus interrupting end user service. This may betime consuming and costly. Removable internal modules, however, maygreatly speeds up repairs by reducing service interruption. To increaseheat dissipation, surface area may be increased and thermal resistancesmay be reduced with removable internal modules. As newer electronics andtechnologies are used, greater power and heat dissipation capability maybe needed.

To address these problems, embodiments of the disclosure may split aconventional sealed two-piece housing into a three-piece sealedstructure. For example, a center frame may be sandwiched between a lidand a back housing. The advantage of this may be that input/output (I/O)hard line Radio Frequency (RF) and fiber connections from the networkmay be connected to the center frame. Consequently, the center frame maystay in place in the network during repairs without needing to cut thehardline cables or remove the fiber stub.

Furthermore, the lid and back housing may include any circuitry (e.g.,from a node to a line amplifier). For a Full Duplex (FDX) node forexample, the back housing may mount a main Launch Amplifier PrintedCircuit Board Assembly (PCBA) directly to a finned mounting surface withembodiments of the disclosure. Thus, a thermal interface resistancecreated by the conventional amplifier modules may be eliminated.Accordingly, the conductive heat dissipation path may be reduced andheat dissipation efficiency may be improved. Similarly, regarding thelid, heat producing components may be directly mounted to a finnedmounting surface in the lid to improve heat conduction and dissipationin the lid.

Moreover, the center frame may be used for adding a power (e.g.,Alternating Current (AC) power) bypass feature. Accordingly, power todown-line nodes may not be interrupted when the current node is down forrepairs. In addition, the center frame may include a cable tray andprovide additional space for fiber and cable management. Furthermore,weather/Electromagnetic Interference (EMI) gaskets may be mounted to thelid and the back housing. Consequently, when either is replaced, a newweather/EMI gasket may be installed.

FIG. 1 shows a three-piece electronics enclosure 100 consistent withembodiments of the disclosure. Three-piece electronics enclosure 100 maycomprise, but is not limited to, a node on an HFC network. As shown inFIG. 1, three-piece electronics enclosure 100 may include a back housing102, a lid 104, and a center frame 106. Back housing 102 may comprise anexterior of the back housing 108, an interior of the back housing 110,back housing heat sinks 112, and a back housing circuitry 114. Backhousing circuitry 114 may comprise, but is not limited to, a launchamplifier.

Back housing circuitry 114 may be mounted directly to an interiorsurface of interior of the back housing 110. In this way a directconductive heat dissipation path may be created from back housingcircuitry 114 to back housing heat sinks 112 and heat may be dissipateddirectly from back housing circuitry 114 to back housing heat sinks 112.

Lid 104 may comprise an exterior of the lid 116, an interior of the lid118, lid heat sinks 120, and lid circuitry 122. Lid circuitry 122 maycomprise a plurality of lid circuitry components 124. Lid circuitrycomponents 124 may comprise, but are not limited to, a first powersupply 126, a second power supply 128, a remote physical layer (R-Phy)circuit 130, a transmitter, a receiver, and an optical interface board.The optical interface board may comprise, but is not limited to, ananalog receiver, R-Phy circuit 130, and a control unit.

Some or all of plurality of lid circuitry components 124 may be mounteddirectly to an interior surface of interior of the lid 118. In this waya direct conductive heat dissipation path may be created from some orall of plurality of lid circuitry components 124 to lid heat sinks 120and heat may be dissipated directly from some or all of plurality of lidcircuitry components 124 to lid heat sinks 120.

Center frame 106 may comprise a center frame first side 132, a centerframe second side 134, a plurality of input/output (I/O) ports 136, anda fiber tray 138. Plurality of I/O ports 136 may comprise a first I/Oport 140 and a second I/O port 142. Fiber tray 138 may be hingablyconnected within center frame 106. As shown in FIG. 1, fiber tray 138may rotate out to at least a horizontal position when lid 104 is openand may rotate to a vertical position in center frame 106 when lid 104is closed.

FIG. 2 shows three-piece electronics enclosure 100 consistent withembodiments of the disclosure where lid 104 may be hingably connected tocenter frame 106 via a hinge 202. As shown in FIG. 2, center frame 106may correspondingly mate with back housing 102 and fiber tray 138 mayrotate to a vertical position within center frame 106. FIG. 3 showsthree-piece electronics enclosure 100 consistent with embodiments of thedisclosure where back housing circuitry 114 may be connected to lidcircuitry 122 via a compact I-Node cable track 302.

FIG. 4 shows a side view of three-piece electronics enclosure 100. Asshown in FIG. 4, lid 104 may swing on hinge 202 and correspondingly matewith center frame 106. A first weather/Electromagnetic Interference(EMI) gasket may be placed between lid 104 and center frame 106. Asecond weather/EMI gasket may be placed between back housing 102 andcenter frame 106. Through bolts may pass from lid 104, through centerframe 106, and attach to back housing 102. By fastening the throughbolts with benefit of the weather/EMI gaskets, three-piece electronicsenclosure 100 may be hermetically sealed.

As shown in FIG. 4, plurality of I/O ports 136 may further include apower port 402, a fiber port 404, and a third I/O port 406. Similarly,center frame first side 132 may also include a power port, fiber ports,and additional I/O ports. Plurality of I/O ports 136 may comprisecoaxial ports that may send and receive Radio Frequency (RF) signals toand from three-piece electronics enclosure 100 that may be processed byback housing circuitry 114 and lid circuitry 122. Similarly, fiber ports(e.g., fiber port 404) may send and receive optical signals to and fromthree-piece electronics enclosure 100 that may be processed by backhousing circuitry 114 and lid circuitry 122. Power ports (e.g., powerport 402) receive and transmit electrical energy.

FIG. 5 shows a power bypass 502 that may be used in conjunction withthree-piece electronics enclosure 100 consistent with embodiments of thedisclosure. As shown in FIG. 5, power bypass 502 may comprise a centerframe first side power bypass circuit 504, a center frame first sidepower bypass circuit cover 512, a center frame second side power bypasscircuit 514, a center frame second side power bypass circuit cover 522,and a power bypass conductor tray 524.

Center frame first side power bypass circuit 504 may comprise aplurality of first side power bypass circuit receptacles that mayinclude, but are not limited to, a first side power bypass circuit firstreceptacle 506, a first side power bypass circuit second receptacle 508,and a first side power bypass circuit third receptacle 510. Center framesecond side power bypass circuit 514 may comprise a plurality of secondside power bypass circuit receptacles that may include, but are notlimited to, a second side power bypass circuit first receptacle 516, asecond side power bypass circuit second receptacle 518, and a secondside power bypass circuit third receptacle 520. Power bypass conductortray 524 may include a power bypass conductor that may conduct electricpower between center frame first side power bypass circuit 504 andcenter frame second side power bypass circuit 514.

In addition to sending and receiving RF signals to and from three-pieceelectronics enclosure 100, hardline coaxial cables may also send andreceive electrical energy to power back housing circuitry 114, lidcircuitry 122, and other HFC nodes up and down the line. Consistent withembodiments of the disclosure, hardline coaxial cables may be connectedto plurality of I/O ports 136. Those hardline coaxial cables connectedto plurality of I/O ports 136 on center frame first side 132 may, inturn be connected to center frame first side power bypass circuit 504.Similarly, those hardline coaxial cables connected to plurality of I/Oports 136 on center frame second side 134 may, in turn be connected tocenter frame second side power bypass circuit 514. These hardlinecoaxial cables may be connected to and may feed power to other HFC nodesup and down the line.

Consistent with embodiments of the disclosure, a power bypass conductorin power bypass conductor tray 524 may electrically connect center framefirst side power bypass circuit 504 and center frame second side powerbypass circuit 514 and pass electrically energy between those hardlinecoaxial cables connected to plurality of I/O ports 136 on center framefirst side 132 and those hardline coaxial cables connected to pluralityof I/O ports 136 on center frame second side 134. Consequently, becauseelectrical energy may be passed by power bypass 502 between thosehardline coaxial cables connected to plurality of I/O ports 136 oncenter frame first side 132 and those hardline coaxial cables connectedto plurality of I/O ports 136 on center frame second side 134, centerframe 106 may stay in place in the network during repairs to three-pieceelectronics enclosure 100 without needing to cut the hardline cables orremove the fiber stub. In this way, power may not be disturbed to otherHFC nodes up and down the line that may be connected to three-pieceelectronics enclosure 100.

FIG. 6 shows a connector 602. Connector 602 may comprise a connectorfirst end 604, a connector second end 606, and a connector middlesection 608. A plurality of connectors 602 may be used where first ends604 may be disposed in the plurality of first side power bypass circuitreceptacles and in the plurality of second side power bypass circuitreceptacles. When center frame 106 is mated with back housing 102,corresponding second ends 606 may connect to receptacles in back housing102 in order to provide electrical energy and RF signals between theaforementioned hardline coaxial cables and back housing circuitry 114.In turn, electrical energy and the RF signals may be provided betweenback housing circuitry 114 and lid circuitry 122 via compact I-Nodecable track 302. Middle section 608 may provide flexibility in makingconnections when center frame 106 is mated with back housing 102.

FIG. 7 shows three-piece electronics enclosure 100. As shown in FIG. 7,ones of plurality of lid circuitry components 124 may be removed from oradded to (e.g., plugged or unplugged) lid 104 without having to openthree-piece electronics enclosure 100. For example, a defective secondpower supply 128 may be removed from lid 104 and a new second powersupply 128 may be added in its place. In other words, lid circuitry 122may comprise a plurality of lid circuitry components wherein at leastone of the plurality of lid circuitry components may removable fromexterior of the lid 118.

FIG. 8 shows second power supply 128 from FIG. 7. As shown in FIG. 8,second power supply 128 may be mounted directly to a removable portionof interior surface of interior of the lid 118. In this way, a directconductive heat dissipation path may be created from second power supply128 to lid heat sinks 120 and heat may be dissipated directly fromsecond power supply 128 to lid heat sinks 120.

FIGS. 9A, 9B, and 9C show a connector device 900 that may be similar toconnector 602 as shown in FIG. 6. Connector device 900 may comprise afirst electrical connector 905, a second electrical connector 910, and abody 915. First electrical connector 905 may comprise a G-type connectorand second electrical connector 910 may comprise a G-type connector. AG-type connector may comprise a 75 ohm connector that may be used as aslide-on/push-on or blind-mating alternative to F-type connectors withperformance up to 1 GHz for example. G-type connectors may comply withthe MIL-STD 202 specification for vibration, shock, thermal shock,moisture resistance, and salt spray.

Body 915 may be disposed between first electrical connector 905 andsecond electrical connector 910. Body 915 may be flexible and maycomprise a center section 920 that may be reduced in diameter ascompared to body 915's first end 925 and to body 915's second end 930.Body 915 may be made of a flexible polymer, rubber, or rubberizedmaterial. Center section 920 may be reduced in diameter in order to aidin the flexibility of body 915. In other words, body 915's first end 925and body 915's second end 930 may be large enough in diameter toaccommodate first electrical connector 905 and second electricalconnector 910 respectively and then center section 920 may be reduced indiameter as compared to body 915's first end 925 and body 915's secondend 930 in order to aid in the flexibility of body 915. Body 915 may bemore flexible if center section 920 has the aforementioned reduced indiameter.

An electrical pathway may be disposed in body 915 between firstelectrical connector 905 and second electrical connector 910. Theelectrical pathway, for example, may comprise a coaxial cable. Theelectrical pathway may comprise an electrically conductive wire.Electrical shielding may be disposed in flexibility of body 915. Theelectrical shielding may comprise, for example, braided strands ofcopper (or other metal, such as aluminum), a non-braided spiral windingof copper tape, or a layer of conducting polymer. The electricalshielding may comprise a Faraday cage, for example, to reduce electricalnoise from affecting the signals, and to reduce electromagneticradiation that may interfere with other devices. The electricalshielding may minimize capacitively coupled noise from other electricalsources.

FIG. 10 shows connector device 900 disposed in three-piece electronicsenclosure 100 consistent with embodiments of the disclosure. As shown inFIG. 10, a back housing circuit board 1005 may include back housingcircuitry 114. Back housing circuit board 1005 may comprise a backhousing circuitry receptacle 1010 that may be electrically connected toback housing circuitry 114. First electrical connector 905 may bedisposed in second side power bypass circuit first receptacle 516 andsecond electrical connector 910 may be disposed in back housingcircuitry receptacle 1010.

A plurality of connector devices 900 may be used where first electricalconnector 905 may be disposed in the plurality of first side powerbypass circuit receptacles (e.g., first side power bypass circuit firstreceptacle 506, first side power bypass circuit second receptacle 508,and first side power bypass circuit third receptacle 510) and wheresecond electrical connector 910 may be disposed in the plurality ofsecond side power bypass circuit receptacles (e.g., second side powerbypass circuit first receptacle 516, second side power bypass circuitsecond receptacle 518, and second side power bypass circuit thirdreceptacle 520). When center frame 106 is mated with back housing 102,corresponding second electrical connectors 910 may connect toreceptacles in back housing 102 in order to provide electrical energyand RF signals between the aforementioned hardline coaxial cables andback housing circuitry 114. In turn, electrical energy and the RFsignals may be provided between back housing circuitry 114 and lidcircuitry 122 via compact I-Node cable track 302. Flexibility of body915 may provide flexibility in making connections when center frame 106is mated with back housing 102.

Embodiments of the present disclosure, for example, are described abovewith reference to block diagrams and/or operational illustrations ofmethods, systems, and computer program products according to embodimentsof the disclosure. The functions/acts noted in the blocks may occur outof the order as shown in any flowchart. For example, two blocks shown insuccession may in fact be executed substantially concurrently or theblocks may sometimes be executed in the reverse order, depending uponthe functionality/acts involved.

While the specification includes examples, the disclosure's scope isindicated by the following claims. Furthermore, while the specificationhas been described in language specific to structural features and/ormethodological acts, the claims are not limited to the features or actsdescribed above. Rather, the specific features and acts described aboveare disclosed as example for embodiments of the disclosure.

What is claimed is:
 1. An apparatus comprising: a back housingcomprising; back housing heat sinks on an exterior of the back housing,and back housing circuitry disposed in an interior of the back housing,the back housing circuitry comprising a back housing circuitryreceptacle electrically connected to the back housing circuitry; a lidcomprising; lid heat sinks on an exterior of the lid, and lid circuitrydisposed in an interior of the lid; a center frame disposed between theback housing and the lid, the center frame comprising, a plurality ofinput/output (I/O) ports comprising a first I/O port and a second I/Oport wherein at least one of the plurality of I/O ports provides powerto the back housing circuitry and the lid circuitry, and a power bypassthat passes power between the first I/O port and the second I/O port,the power bypass comprising a power bypass circuit comprising a powerbypass circuit receptacle electrically connected to the first I/O portand the second I/O port; and a connector device comprising; a firstelectrical connector disposed in the power bypass circuit receptacle, asecond electrical connector disposed in a back housing circuitryreceptacle, a body disposed between the first electrical connector andthe second electrical connector, and an electrical pathway disposed inthe body between the first electrical connector and the secondelectrical connector.
 2. The apparatus of claim 1, wherein the firstelectrical connector comprises a G-type connector.
 3. The apparatus ofclaim 1, wherein the second electrical connector comprises a G-typeconnector.
 4. The apparatus of claim 1, wherein the body is flexible. 5.The apparatus of claim 1, wherein the electrical pathway comprises acoaxial cable.
 6. The apparatus of claim 1, further comprisingelectrical shielding disposed in the body.
 7. The apparatus of claim 1,wherein the electrical pathway comprises an electrically conductivewire.
 8. The apparatus of claim 1, wherein the back housing circuitry isdisposed in an interior of the back housing and comprises a launchamplifier mounted directly to an interior surface of the back housing.9. The apparatus of claim 1, wherein the lid circuitry is disposed in aninterior of the lid and comprises a plurality of lid circuitrycomponents wherein at least one of the plurality of lid circuitrycomponents comprises one of the following: a power supply; a remotephysical layer (R-Phy) circuit; a transmitter; and a receiver.
 10. Theapparatus of claim 1, wherein the center frame further comprises a fibertray wherein the fiber tray is hingably connected within the centerframe.
 11. The apparatus of claim 1, wherein the first I/O portcomprises a coaxial cable port and the second I/O port comprises acoaxial cable port and wherein the first I/O port is disposed on a firstside of the center frame and the second I/O port is disposed on a secondside of the center frame.
 12. An apparatus comprising: a center framedisposed between a back housing and a lid, the center frame comprising,a plurality of input/output (I/O) ports comprising a first I/O port anda second I/O port wherein at least one of the plurality of I/O portsprovides power to back housing circuitry and lid circuitry, and a powerbypass that passes power between the first I/O port and the second I/Oport, the power bypass comprising a power bypass circuit comprising apower bypass circuit receptacle electrically connected to the first I/Oport and the second I/O port; and a connector device comprising; a firstelectrical connector disposed in the power bypass circuit receptacle, asecond electrical connector disposed in a back housing circuitryreceptacle, a body disposed between the first electrical connector andthe second electrical connector, and an electrical pathway disposed inthe body between the first electrical connector and the secondelectrical connector.
 13. The apparatus of claim 12, wherein the firstelectrical connector comprises a G-type connector.
 14. The apparatus ofclaim 12, wherein the second electrical connector comprises a G-typeconnector.
 15. The apparatus of claim 12, wherein the body is flexible.16. The apparatus of claim 12, wherein the electrical pathway comprisesa coaxial cable.
 17. The apparatus of claim 12, further comprisingelectrical shielding disposed in the body.
 18. The apparatus of claim12, wherein the electrical pathway comprises an electrically conductivewire.
 19. The apparatus of claim 12, wherein the back housing circuitryis disposed in an interior of the back housing and comprises a launchamplifier mounted directly to an interior surface of the back housing.20. The apparatus of claim 12, wherein the lid circuitry is disposed inan interior of the lid and comprises a plurality of lid circuitrycomponents wherein at least one of the plurality of lid circuitrycomponents comprises one of the following: a power supply; a remotephysical layer (R-Phy) circuit; a transmitter; and a receiver.